Machined aluminum semiconductor cold plate with copper coolant path and fluid ports

PRECISION THERMAL MANUFACTURING

Semiconductor Cold Plates & Precision CNC Machining

Custom aluminum and copper cooling components follow your IGBT, SiC and semiconductor equipment drawings. Controlled contact surfaces, coolant passages and mounting features help your team move from design to repeatable assembly.

Turn your semiconductor cooling design into a manufacturable component.

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Explore Our Manufacturing Capabilities →
Custom CNC MachiningLiquid Cold PlatesPrecision Metal ComponentsDrawing-Based OEM Support

SEMICONDUCTOR COOLING CHALLENGES

Thermal & Manufacturing Challenges
in Power Semiconductors

Precision contact faces, controlled coolant channels and well-defined sealing interfaces translate your thermal design into components that fit and function as intended.

High Heat Flux

Concentrated heat from IGBT and SiC modules requires an effective transfer path. Drawing-defined contact areas and passages support your system’s cooling targets.

Critical Contact Flatness

Specified flatness and surface finish help maintain thermal interface contact, reducing avoidable variation during module installation.

Coolant Flow & Pressure Drop

Channel geometry must suit the available flow and pressure budget. Manufacturing review identifies access and wall-thickness constraints before production.

Sealing & Reliability

Controlled ports, joining surfaces and seal features support agreed leak and pressure requirements, giving your team clear acceptance criteria.

Reliable semiconductor cooling starts with controlled manufacturing.

Discuss Your Cooling Challenges

SEMICONDUCTOR APPLICATIONS

Liquid Cooling Applications for
IGBT, SiC & Semiconductor Equipment

Custom contact surfaces, mounting patterns and fluid interfaces adapt cooling components to each assembly, helping your team integrate power module liquid cooling with fewer mechanical compromises.

IGBT Power Modules

IGBT Power Modules

An IGBT cold plate combines module-specific mounting geometry with defined coolant paths, supporting heat removal in power conversion systems.

SiC Power Modules

SiC Power Modules

A SiC module cold plate matches the contact footprint and fluid requirements of compact power assemblies, supporting demanding thermal interfaces.

Semiconductor Equipment

Semiconductor Equipment

A semiconductor equipment cooling plate, manifold or machined housing follows the equipment drawing, preserving accurate mechanical and fluid connections.

Match your cooling component to the equipment it serves.

Discuss Your Application

PRODUCT OVERVIEW

Custom Semiconductor Cold Plates
& Precision Cooling Components

Drawing-based manufacturing brings thermal contact faces, coolant channels and mounting features into one coordinated component, simplifying integration into your power electronics assembly.

A controlled path from module to coolant.

A semiconductor cold plate conducts heat from a power module into circulating coolant. Its contact surface, internal passages and connection ports work together to carry heat away from the assembly.

JBT reviews aluminum and copper bases, covers and cooling structures against your drawings so critical interfaces remain aligned with the approved design.

Copper cooling plate with parallel machined channels and mounting features

Heat Transfer

Defined contact geometry supports conduction from the module to the coolant, helping maintain the intended thermal path.

Coolant Distribution

Machined passages retain the approved flow layout, helping coordinate coolant routing within the available space.

Precision Integration

Accurate holes, ports and locating features support assembly fit, reducing the need for adjustments during installation.

Bring thermal, hydraulic and mounting requirements into one manufacturing review.

Discuss Your Cold Plate Design

CUSTOM POWER MODULE COOLING

Custom Liquid Cooling Solutions
for IGBT & SiC Power Modules

Module-specific geometry coordinates thermal contact, coolant routing and mechanical fit, helping your engineering team carry the approved cooling design into production.

IGBT Cold Plate Manufacturing

IGBT Cold Plate Manufacturing

Machined contact faces, mounting holes and channel structures follow the IGBT module footprint. Reviewing flatness, seal geometry and port locations together supports consistent assembly.

SiC Module Cold Plate Manufacturing

SiC Module Cold Plate Manufacturing

Custom copper or aluminum cooling bases retain specified contact areas and coolant passages. Manufacturing review considers mounting stress, pressure drop and joining feasibility to support compact power assemblies.

Use your approved drawings to define the cooling structure and acceptance criteria.

Request Custom Manufacturing Support

PRECISION CNC MACHINING

Precision CNC Machining
for Semiconductor Cold Plates

Milling, drilling and tapping create the contact faces and fluid interfaces your design requires, helping each cooling component fit the intended power semiconductor assembly.

CNC tool machining a copper cooling plate

Machining reference from the supplied brief; shown to illustrate component features.

Precision manufacturing for critical cooling features.

JBT reviews aluminum and copper components for machining feasibility, tool access and critical tolerances. Channel pockets, sealing faces and mounting interfaces are considered together so process choices support the complete part.

Drawing-defined inspection criteria give prototypes and repeat orders a consistent basis for acceptance.

Precision Contact Surfaces

Specified flatness and finish align the contact face with the thermal interface, supporting predictable module installation.

Cooling Channel Machining

Milled passages, cavities and distribution features preserve your approved geometry, helping maintain the intended coolant route.

Mounting & Connection Features

Accurate drilled and tapped features coordinate module placement and fluid connections, simplifying assembly.

Repeatable Production

A defined process and inspection scope maintain the critical features across samples and repeat orders.

Resolve tool access, contact surfaces and mounting details before production.

Explore CNC Machining Capabilities

ADVANCED MANUFACTURING PROCESSES

Manufacturing Processes for
Semiconductor Liquid Cold Plates

Evaluate machining and joining routes against the material and channel layout to select a practical process for your custom cooling structure.

CNC Machining

CNC Machining

Milling creates bases, channels and mounting features to the approved drawing, allowing custom geometry to be integrated into one component.

Vacuum Brazing

Vacuum Brazing

Suitable multi-piece designs can be reviewed for brazed construction. Material and process compatibility determine whether enclosed passages are feasible.

Friction Stir Welding

Friction Stir Welding

Selected aluminum bases and covers can be evaluated for solid-state joining, providing an option for enclosing suitable coolant channels.

Surface Finishing & Assembly

Surface Finishing & Assembly

Defined surface preparation, cleaning and interface checks support the specified finish and fit, helping prepare components for assembly.

Process reference images from the supplied brief. Process scope and production arrangements are confirmed during project review.

Match the process to the component geometry, material and inspection requirements.

Discuss Your Manufacturing Process

MATERIALS & SURFACE FINISHING

Materials for Semiconductor Cold Plates
& Precision Cooling Parts

Balance heat transfer, weight, corrosion behavior and machining requirements to choose a material that suits the cooling system and production route.

Copper Cold Plate Components

Copper Cold Plate Components

High thermal conductivity supports heat spreading at demanding interfaces, helping transfer concentrated module heat into the cooling structure.

Aluminum Cold Plate Components

Aluminum Cold Plate Components

Low weight and machining flexibility support suitable cooling plates and manifolds, helping balance mechanical integration and manufacturing cost.

Stainless Steel Components

Stainless Steel Components

Selected grades provide specified corrosion and mechanical properties for fittings and hardware, supporting compatible coolant-loop connections.

Surface Treatments & Coolant Compatibility

Review coolant chemistry, galvanic corrosion, seal contact and electrical requirements before choosing a surface treatment. Specified machining finishes, protective coatings or appropriate anodizing help align component surfaces with the operating environment.

Coordinate the alloy, coolant and finish before releasing your drawings.

Discuss Material Requirements

ENGINEERING & DFM SUPPORT

Critical Engineering Parameters
for Semiconductor Cold Plates

Coordinate thermal contact, fluid requirements and mechanical tolerances early so your cooling component can be evaluated against a clear manufacturing specification.

Generic IGBT cold plate diagram identifying mounting surface, coolant inlet and coolant outlet

Generic engineering reference; no project-specific performance values are implied.

Contact Surface Flatness

Specify flatness and finish for the module interface to support the required contact quality.

Mounting Interface Accuracy

Define hole positions, threads and tolerances so the component fits the intended assembly.

Coolant Channel Geometry

Review passages, wall thickness and tool access to establish a feasible manufacturing route.

Flow & Pressure Requirements

Provide target flow, pressure drop and working pressure to guide geometry and verification review.

Thermal Performance Targets

Share heat load and coolant conditions so acceptance requirements reflect the intended operating environment.

Material & Sealing Design

Coordinate alloys, joint interfaces and seal features to support compatible coolant containment.

Design for Manufacturability Review

Early drawing review identifies machining access, joining constraints and tolerance interactions. Resolving these points before prototyping gives your team a clearer basis for cost, inspection and production decisions.

Use the critical interfaces in your drawing to guide the manufacturing plan.

Submit Your Drawing for DFM Review

QUALITY & VALIDATION

Quality Inspection & Validation
for Semiconductor Cold Plates

Drawing-based inspection and agreed test conditions connect the finished component to measurable acceptance requirements, helping your team evaluate fit and coolant containment.

Dimensional Inspection

Defined checks verify mounting locations, contact faces and critical features against the drawing, supporting consistent assembly.

Leak Integrity

Agreed leakage limits and applicable methods provide a clear basis for reviewing the sealing structure.

Pressure Requirements

Specified working and proof-test conditions guide the verification scope, helping assess containment requirements.

Flow & Thermal Verification

Flow, pressure-drop and thermal criteria are reviewed against available test arrangements so reports address the application requirements.

Dimensional inspection reference showing a machined cooling component on an inspection bench

Inspection reference image from the supplied brief; test methods and equipment arrangements are confirmed per project.

Agree inspection methods, acceptance limits and reporting scope before production.

Discuss Your Quality Requirements

OUR MANUFACTURING CAPABILITIES

Precision CNC Manufacturing
for Semiconductor Cooling Components

Drawing-based machining coordinates custom geometry and quality requirements, helping OEM teams source cooling bases, manifolds and precision metal components from one manufacturing partner.

CNC Machining Workshop

CNC Machining Workshop

Milling, drilling and tapping support custom aluminum and copper geometry, bringing cooling interfaces into the approved manufacturing scope.

Precision Metal Processing

Precision Metal Processing

Controlled machining of pockets, holes and contact features supports accurate mechanical fit across complex components.

Quality Inspection

Quality Inspection

Drawing-defined dimensional checks provide a consistent basis for reviewing prototypes and production parts.

Manufacturing reference images supplied in the brief; shown as process illustrations rather than verified JBT facility photographs.

Direct Manufacturing Support

Discuss technical requirements with a manufacturing-focused team to keep component decisions aligned with production needs.

Flexible Machining Processes

Review milling, turning, drilling and tapping together to select a workable route for the part.

Quality-Focused Production

Agree critical dimensions and inspection documentation so acceptance criteria remain clear throughout the order.

Drawing-Based OEM Service

Review geometry, materials and quantities early to support informed quotation and production planning.

Bring your part drawings and production requirements into one technical discussion.

Learn More About Our Factory

CUSTOM MANUFACTURING EXAMPLES

Precision Machined Components
for Semiconductor Cooling Applications

Typical component requirements illustrate how manufacturing choices support thermal contact, coolant routing and assembly fit. These examples describe custom part types rather than completed customer projects.

IGBT Module Liquid Cold Plate

COMPONENT EXAMPLE 01

IGBT Module Liquid Cold Plate

A custom aluminum or copper cold plate with module-specific contact faces, internal channels and fluid ports.

Review flatness, mounting positions and seal geometry together to support consistent power module integration.

SiC Power Module Cooling Base

COMPONENT EXAMPLE 02

SiC Power Module Cooling Base

A precision cooling base with defined thermal contact areas, mounting holes and specified surface finish.

Coordinate contact quality, mounting accuracy and material requirements to support the intended thermal interface.

Semiconductor Equipment Cooling Components

COMPONENT EXAMPLE 03

Semiconductor Equipment Cooling Components

Machined plates, manifolds and structural parts with custom passages and customer-defined interfaces.

Review drawing compliance, cleanliness and assembly fit to simplify integration into selected semiconductor equipment.

Share a similar component to discuss manufacturing feasibility and quotation.

Discuss a Similar Manufacturing Project

CUSTOM MANUFACTURING PROCESS

From Engineering Drawings
to Semiconductor Cold Plate Production

A defined review and approval process connects your part requirements to the manufacturing plan, helping your team make informed decisions from RFQ through delivery.

01

Submit Your Drawings

Provide 2D/3D files, materials, quantities and operating conditions so the review starts with the complete component requirements.

02

Engineering & DFM Review

Review tool access, tolerances and joining options to identify manufacturing constraints before quotation.

03

Quotation & Confirmation

Agree scope, specifications and production arrangements so technical and commercial expectations remain aligned.

04

Prototype Manufacturing

Produce samples where required for dimensional and assembly evaluation, helping validate the component before repeat orders.

05

Inspection & Approval

Review agreed measurements and test results against the approved requirements to establish acceptance.

06

Production & Delivery

Coordinate production, inspection and protective packaging according to the confirmed order requirements.

Ready to start your semiconductor cooling project? Send your drawings for review.

Submit Your RFQ

FREQUENTLY ASKED QUESTIONS

Semiconductor Cold Plate
Manufacturing FAQs

Review common questions about IGBT and SiC cooling components, machining, materials and inspection so your RFQ includes the details needed for manufacturing review.

Can JBT manufacture custom semiconductor cold plates based on our drawings?

Yes. JBT reviews customer drawings, materials, tolerances and manufacturing requirements for custom CNC machined cooling components. A defined technical scope supports a more relevant quotation.

What is the difference between an IGBT cold plate and a SiC module cold plate?

Both transfer power module heat into coolant. The required footprint, mounting geometry, contact surface and flow conditions depend on the specific module and system design. Reviewing these interfaces helps align the component with the application.

What materials are commonly used for semiconductor cold plates?

Copper and aluminum are common options. Thermal requirements, coolant compatibility, weight and manufacturing route determine the appropriate choice. Selected stainless steel grades may suit fittings and hardware.

Can you machine complex internal cooling channels?

Custom channel layouts can be reviewed for CNC machining. Tool access, passage size, wall thickness and joining structure determine feasibility, helping establish a practical production route before samples are made.

Do you support vacuum brazing and friction stir welding?

These processes can be considered for suitable cold plate designs. Material compatibility, geometry and available production arrangements are confirmed during engineering review so the proposed route matches the component requirements.

What inspection and testing requirements can be discussed?

Dimensional inspection, contact surfaces, leakage limits, pressure conditions and flow criteria can be reviewed. Methods, acceptance limits and reporting scope are confirmed for each project to provide a clear basis for evaluation.

Can JBT support prototype and volume production?

Prototype and repeat-production inquiries are supported. Quantities, lead times and process arrangements depend on the component geometry, material and order requirements.

What information should we provide for a quotation?

Provide 2D/3D drawings, material, quantities, tolerances, finish and mounting requirements. Coolant, pressure, flow and thermal conditions help define an electronic power module cold plate or custom cold plate for semiconductor equipment more completely.

Have a requirement that needs a closer technical review?

Contact Our Manufacturing Team

START YOUR CUSTOM PROJECT

Need Custom Cold Plates
for Your Semiconductor Project?

Custom CNC machining brings your thermal contact faces, coolant routes and mounting geometry into one production specification, helping your team source components matched to the assembly.

Custom Manufacturing

Drawing-based aluminum and copper components preserve the critical geometry required by your application.

Engineering Review

Early discussion of tolerances, materials and process constraints helps establish a practical manufacturing route.

Quality-Focused Production

Agreed inspection requirements provide a clear basis for evaluating samples and repeat production.

Request a Custom Semiconductor Cold Plate Quote

Prepare your project details and engineering drawings for manufacturing review.

Online RFQ submission is being configured. Please contact our team to arrange a secure drawing transfer.

Share your drawings, target quantities and critical specifications to begin.

Contact Our Manufacturing Team